HDMP-1012

 

The HDMP-1012 transmitter and the HDMP-1014 receiver are used to build a high speed data link for point to point communication.

The monolithic silicon bipolar transmitter chip and receiver chip are each provided in a standard aluminum M-Quad 80 package. From the user's viewpoint, these products can be thought of as providing a "virtual ribbon cable" interface for the transmission of data. Parallel data loaded into the Tx (transmitter) chip is delivered to the Rx (receiver) chip over a serial channel, which can be either a coaxial copper cable or optical link.

The chip set hides from the user all the complexity of encoding, multiplexing, clock extraction, demultiplexing and decoding. Unlike other links, the phaselocked- loop clock extraction circuit also transparently provides for frame synchronization - the user is not troubled with the periodic insertion of frame synchronization words. In addition, the dc balance of the line code is automatically maintained by the chip set. Thus, the user can transmit arbitrary data without restriction.

The Rx chip also includes a state-machine controller (SMC) that provides a startup handshake protocol for the duplex link configuration. The serial data rate of the T/R link is selectable in four ranges (see tables on page 5), and extends from 120 Mbits/s up to 1.25 Gbits/s. The parallel data interface is 16 or 20 bit single-ended ECL, pin selectable. A flag bit is available and can be used as an extra 17th or 21st bit under the user's control.

The flag bit can also be used as an even or odd frame indicator for dual-frame transmission. If not used, the link performs expanded error detection. The serial link is synchronous, and both frame synchronization and bit synchronization are maintained. When data is not available to send, the link maintains synchronization by transmitting fill frames. Two (training) fill frames are reserved for handshaking during link startup.

User control space is al

Symbol	Parameter	Units	Min.	Max.
VEE	Supply Voltage	V	-7	+0.5
VIN,ECL	ECL Input Voltage	V	-3	+0.5
VIN,BLL	H50 Input Voltage	V	-2	+1
IO,ECL	ECL Output Source Current	mA		+50
Tstg	Storage Temperature	°C	-40	+130
TJ	Junction Temperature	°C	-40	+130
Tmax	Maximum Assembly Temperature (for 10 seconds maximum)	°C		+260